HPE Cray Supercomputing EX4000 (NVIDIA GB200)

HPE Cray Supercomputing EX4000 (NVIDIA GB200)

Brand: HPE | Category: Servers

SKU: HP-P78420B21 | Part #: P78420-B21 | MPN: P78420-B21

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About the HPE Cray Supercomputing EX4000 (NVIDIA GB200)

The HPE Cray Supercomputing EX4000 with NVIDIA GB200 is a purpose-built, liquid-cooled blade supercomputing platform engineered to maximize AI training throughput and HPC simulation density within a single rack-scale system. At its core, the EX4000 integrates the NVIDIA GB200 NVL72 architecture, pairing 36 Grace Arm-based CPU dies with 72 Blackwell B200 GPUs across a high-bandwidth NVLink Switch fabric delivering up to 130 TB/s of NVLink bandwidth within the rack domain. Direct Liquid Cooling (DLC) throughout the blade chassis enables sustained Tensor Core utilization at scale, eliminating the thermal headroom constraints that limit air-cooled GPU systems and allowing rack-level TDP ratings that far exceed traditional server designs.

The EX4000 chassis employs HPE Cray's modular blade architecture, where compute blades slot into a shared high-bandwidth backplane interconnected by a purpose-designed HPE Slingshot 11 high-speed fabric providing 200 Gb/s per port with adaptive routing and congestion management. This eliminates fabric bottlenecks that emerge in loosely coupled GPU clusters, enabling the system to operate as a unified accelerated compute fabric rather than a collection of discrete servers. The platform supports HPE Cray ClusterStor storage integration, Cray Programming Environment (CPE), and is compatible with standard MPI, NCCL, and CUDA-based HPC/AI software stacks, providing a familiar developer experience with supercomputer-grade performance characteristics.

Targeted at national laboratories, hyperscale AI research facilities, aerospace and defense HPC programs, and enterprise AI factories, the EX4000 is notable for delivering exaflop-class FP8 training density in a footprint that scales from a single cabinet to multi-thousand-node installations. Its tight integration of NVIDIA's GB200 NVL72 reference topology with HPE's decades of Cray supercomputing chassis engineering produces a system that achieves both memory bandwidth and interconnect bandwidth at a scale previously confined to purpose-built supercomputer deployments, making frontier-class AI model training accessible within a commercially orderable platform.

Ideal for

  • Large language model (LLM) pre-training at trillion-parameter scale using FP8 and BF16 mixed-precision Tensor Core operations across the full NVLink-connected GPU pool
  • Computational fluid dynamics (CFD) and finite element analysis (FEA) simulations for aerospace, automotive, and energy sector engineering requiring extreme parallel floating-point throughput
  • Climate and weather modeling at global resolution, leveraging GPU-accelerated numerical solvers and the high-bandwidth Slingshot fabric for distributed memory communication
  • Genomics and drug discovery pipelines running GPU-accelerated molecular dynamics (GROMACS, NAMD, AlphaFold) at population-scale dataset volumes
  • Generative AI inference serving for large multimodal models requiring NVLink-unified GPU memory pools to hold multi-hundred-billion parameter models in active memory
  • Government and defense high-performance computing workloads including signals intelligence processing, Monte Carlo simulations, and classified AI model development on air-gapped supercomputer fabrics

Technical specifications

ManufacturerHP (HPE)
Product LineHPE Cray Supercomputing EX4000
GPU ArchitectureNVIDIA Blackwell (GB200)
NVL72 Configuration72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain
GPU Memory per B200192 GB HBM3e
Total GPU Memory per NVL72 RackUp to 13,824 GB (13.5 TB) HBM3e unified via NVLink
NVLink Fabric Bandwidth (NVL72)130 TB/s bisectional NVLink Switch bandwidth within rack domain
CPU (Grace)NVIDIA Grace CPU, 72-core Arm Neoverse V2, per CPU die; two Grace dies per GB200 Superchip
CPU Memory per Superchip480 GB LPDDR5X with 960 GB/s memory bandwidth (CPU + GPU coherent via NVLink-C2C)
Peak AI Compute (FP8, NVL72)Up to 1.44 ExaFLOPS FP8 Tensor Core performance
Peak AI Compute (BF16, NVL72)Up to 720 PetaFLOPS BF16 Tensor Core performance
System Interconnect FabricHPE Slingshot 11, 200 Gb/s per port, adaptive routing, low-latency congestion control
Chassis Form FactorHPE Cray EX4000 blade chassis, rack-integrated, designed for NVL72 rack unit footprint
Cooling TechnologyFull Direct Liquid Cooling (DLC); no air-cooled GPU thermal dependency; rear-door heat exchanger compatible
Rack-Level TDPUp to 120 kW per NVL72 rack (liquid-cooled thermal envelope)
Storage IntegrationHPE Cray ClusterStor E1000 compatible; NVMe-oF over Slingshot; Lustre and DAOS file system support
OS and Software EnvironmentSUSE Linux Enterprise HPC, HPE Cray Programming Environment (CPE), CUDA 12.x, NCCL, OpenMPI, UCX
Security FeaturesSecure boot, TPM 2.0, iLO 6 BMC out-of-band management, role-based access control, FIPS 140-2 module support
ManagementHPE iLO 6, HPE Cray System Management (CSM), Redfish API, Prometheus/Grafana telemetry integration
Power SupplyRedundant high-efficiency AC/DC power shelves, 48V DC distribution to blades, IEC 60309 facility input
ScalabilityScales from single cabinet to multi-thousand node installations via Slingshot dragonfly topology
Launch Generation2025 (Q3 commercial availability)

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandHPE
CategoryServers
SKUHP-P78420B21
Part NumberP78420-B21
ConditionNew
Product LineHPE Cray Supercomputing EX4000
GPU ArchitectureNVIDIA Blackwell (GB200)
NVL72 Configuration72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain
GPU Memory per B200192 GB HBM3e
Total GPU Memory per NVL72 RackUp to 13,824 GB (13.5 TB) HBM3e unified via NVLink
NVLink Fabric Bandwidth (NVL72)130 TB/s bisectional NVLink Switch bandwidth within rack domain
CPU (Grace)NVIDIA Grace CPU, 72-core Arm Neoverse V2, per CPU die; two Grace dies per GB200 Superchip
CPU Memory per Superchip480 GB LPDDR5X with 960 GB/s memory bandwidth (CPU + GPU coherent via NVLink-C2C)
Peak AI Compute (FP8, NVL72)Up to 1.44 ExaFLOPS FP8 Tensor Core performance
Peak AI Compute (BF16, NVL72)Up to 720 PetaFLOPS BF16 Tensor Core performance
System Interconnect FabricHPE Slingshot 11, 200 Gb/s per port, adaptive routing, low-latency congestion control
Chassis Form FactorHPE Cray EX4000 blade chassis, rack-integrated, designed for NVL72 rack unit footprint
Cooling TechnologyFull Direct Liquid Cooling (DLC); no air-cooled GPU thermal dependency; rear-door heat exchanger compatible
Rack-Level TDPUp to 120 kW per NVL72 rack (liquid-cooled thermal envelope)
Storage IntegrationHPE Cray ClusterStor E1000 compatible; NVMe-oF over Slingshot; Lustre and DAOS file system support
OS and Software EnvironmentSUSE Linux Enterprise HPC, HPE Cray Programming Environment (CPE), CUDA 12.x, NCCL, OpenMPI, UCX
Security FeaturesSecure boot, TPM 2.0, iLO 6 BMC out-of-band management, role-based access control, FIPS 140-2 module support
ManagementHPE iLO 6, HPE Cray System Management (CSM), Redfish API, Prometheus/Grafana telemetry integration
Power SupplyRedundant high-efficiency AC/DC power shelves, 48V DC distribution to blades, IEC 60309 facility input
ScalabilityScales from single cabinet to multi-thousand node installations via Slingshot dragonfly topology
Launch Generation2025 (Q3 commercial availability)

Frequently Asked Questions about HPE Cray Supercomputing EX4000 (NVIDIA GB200)

What does the HPE Cray Supercomputing EX4000 (NVIDIA GB200) do?

The HPE Cray Supercomputing EX4000 (NVIDIA GB200) is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.

What are the headline specs of the HPE Cray Supercomputing EX4000 (NVIDIA GB200)?

Key specifications for the HPE Cray Supercomputing EX4000 (NVIDIA GB200): new condition; manufacturer HP (HPE); product line HPE Cray Supercomputing EX4000; gpu architecture NVIDIA Blackwell (GB200); nvl72 configuration 72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain; gpu memory per b200 192 GB HBM3e; total gpu memory per nvl72 rack Up to 13,824 GB (13.5 TB) HBM3e unified via NVLink. Manufacturer part number P78420-B21. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.