Brand: HPE | Category: Servers
SKU: HP-P78420B21 | Part #: P78420-B21 | MPN: P78420-B21
Contact for Pricing — Request a Quote
The HPE Cray Supercomputing EX4000 with NVIDIA GB200 is a purpose-built, liquid-cooled blade supercomputing platform engineered to maximize AI training throughput and HPC simulation density within a single rack-scale system. At its core, the EX4000 integrates the NVIDIA GB200 NVL72 architecture, pairing 36 Grace Arm-based CPU dies with 72 Blackwell B200 GPUs across a high-bandwidth NVLink Switch fabric delivering up to 130 TB/s of NVLink bandwidth within the rack domain. Direct Liquid Cooling (DLC) throughout the blade chassis enables sustained Tensor Core utilization at scale, eliminating the thermal headroom constraints that limit air-cooled GPU systems and allowing rack-level TDP ratings that far exceed traditional server designs.
The EX4000 chassis employs HPE Cray's modular blade architecture, where compute blades slot into a shared high-bandwidth backplane interconnected by a purpose-designed HPE Slingshot 11 high-speed fabric providing 200 Gb/s per port with adaptive routing and congestion management. This eliminates fabric bottlenecks that emerge in loosely coupled GPU clusters, enabling the system to operate as a unified accelerated compute fabric rather than a collection of discrete servers. The platform supports HPE Cray ClusterStor storage integration, Cray Programming Environment (CPE), and is compatible with standard MPI, NCCL, and CUDA-based HPC/AI software stacks, providing a familiar developer experience with supercomputer-grade performance characteristics.
Targeted at national laboratories, hyperscale AI research facilities, aerospace and defense HPC programs, and enterprise AI factories, the EX4000 is notable for delivering exaflop-class FP8 training density in a footprint that scales from a single cabinet to multi-thousand-node installations. Its tight integration of NVIDIA's GB200 NVL72 reference topology with HPE's decades of Cray supercomputing chassis engineering produces a system that achieves both memory bandwidth and interconnect bandwidth at a scale previously confined to purpose-built supercomputer deployments, making frontier-class AI model training accessible within a commercially orderable platform.
| Manufacturer | HP (HPE) |
| Product Line | HPE Cray Supercomputing EX4000 |
| GPU Architecture | NVIDIA Blackwell (GB200) |
| NVL72 Configuration | 72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain |
| GPU Memory per B200 | 192 GB HBM3e |
| Total GPU Memory per NVL72 Rack | Up to 13,824 GB (13.5 TB) HBM3e unified via NVLink |
| NVLink Fabric Bandwidth (NVL72) | 130 TB/s bisectional NVLink Switch bandwidth within rack domain |
| CPU (Grace) | NVIDIA Grace CPU, 72-core Arm Neoverse V2, per CPU die; two Grace dies per GB200 Superchip |
| CPU Memory per Superchip | 480 GB LPDDR5X with 960 GB/s memory bandwidth (CPU + GPU coherent via NVLink-C2C) |
| Peak AI Compute (FP8, NVL72) | Up to 1.44 ExaFLOPS FP8 Tensor Core performance |
| Peak AI Compute (BF16, NVL72) | Up to 720 PetaFLOPS BF16 Tensor Core performance |
| System Interconnect Fabric | HPE Slingshot 11, 200 Gb/s per port, adaptive routing, low-latency congestion control |
| Chassis Form Factor | HPE Cray EX4000 blade chassis, rack-integrated, designed for NVL72 rack unit footprint |
| Cooling Technology | Full Direct Liquid Cooling (DLC); no air-cooled GPU thermal dependency; rear-door heat exchanger compatible |
| Rack-Level TDP | Up to 120 kW per NVL72 rack (liquid-cooled thermal envelope) |
| Storage Integration | HPE Cray ClusterStor E1000 compatible; NVMe-oF over Slingshot; Lustre and DAOS file system support |
| OS and Software Environment | SUSE Linux Enterprise HPC, HPE Cray Programming Environment (CPE), CUDA 12.x, NCCL, OpenMPI, UCX |
| Security Features | Secure boot, TPM 2.0, iLO 6 BMC out-of-band management, role-based access control, FIPS 140-2 module support |
| Management | HPE iLO 6, HPE Cray System Management (CSM), Redfish API, Prometheus/Grafana telemetry integration |
| Power Supply | Redundant high-efficiency AC/DC power shelves, 48V DC distribution to blades, IEC 60309 facility input |
| Scalability | Scales from single cabinet to multi-thousand node installations via Slingshot dragonfly topology |
| Launch Generation | 2025 (Q3 commercial availability) |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | HPE |
| Category | Servers |
| SKU | HP-P78420B21 |
| Part Number | P78420-B21 |
| Condition | New |
| Product Line | HPE Cray Supercomputing EX4000 |
| GPU Architecture | NVIDIA Blackwell (GB200) |
| NVL72 Configuration | 72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain |
| GPU Memory per B200 | 192 GB HBM3e |
| Total GPU Memory per NVL72 Rack | Up to 13,824 GB (13.5 TB) HBM3e unified via NVLink |
| NVLink Fabric Bandwidth (NVL72) | 130 TB/s bisectional NVLink Switch bandwidth within rack domain |
| CPU (Grace) | NVIDIA Grace CPU, 72-core Arm Neoverse V2, per CPU die; two Grace dies per GB200 Superchip |
| CPU Memory per Superchip | 480 GB LPDDR5X with 960 GB/s memory bandwidth (CPU + GPU coherent via NVLink-C2C) |
| Peak AI Compute (FP8, NVL72) | Up to 1.44 ExaFLOPS FP8 Tensor Core performance |
| Peak AI Compute (BF16, NVL72) | Up to 720 PetaFLOPS BF16 Tensor Core performance |
| System Interconnect Fabric | HPE Slingshot 11, 200 Gb/s per port, adaptive routing, low-latency congestion control |
| Chassis Form Factor | HPE Cray EX4000 blade chassis, rack-integrated, designed for NVL72 rack unit footprint |
| Cooling Technology | Full Direct Liquid Cooling (DLC); no air-cooled GPU thermal dependency; rear-door heat exchanger compatible |
| Rack-Level TDP | Up to 120 kW per NVL72 rack (liquid-cooled thermal envelope) |
| Storage Integration | HPE Cray ClusterStor E1000 compatible; NVMe-oF over Slingshot; Lustre and DAOS file system support |
| OS and Software Environment | SUSE Linux Enterprise HPC, HPE Cray Programming Environment (CPE), CUDA 12.x, NCCL, OpenMPI, UCX |
| Security Features | Secure boot, TPM 2.0, iLO 6 BMC out-of-band management, role-based access control, FIPS 140-2 module support |
| Management | HPE iLO 6, HPE Cray System Management (CSM), Redfish API, Prometheus/Grafana telemetry integration |
| Power Supply | Redundant high-efficiency AC/DC power shelves, 48V DC distribution to blades, IEC 60309 facility input |
| Scalability | Scales from single cabinet to multi-thousand node installations via Slingshot dragonfly topology |
| Launch Generation | 2025 (Q3 commercial availability) |
The HPE Cray Supercomputing EX4000 (NVIDIA GB200) is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.
Key specifications for the HPE Cray Supercomputing EX4000 (NVIDIA GB200): new condition; manufacturer HP (HPE); product line HPE Cray Supercomputing EX4000; gpu architecture NVIDIA Blackwell (GB200); nvl72 configuration 72x NVIDIA B200 Tensor Core GPUs + 36x NVIDIA Grace Arm CPUs per NVL72 rack domain; gpu memory per b200 192 GB HBM3e; total gpu memory per nvl72 rack Up to 13,824 GB (13.5 TB) HBM3e unified via NVLink. Manufacturer part number P78420-B21. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.