ASUS ESC8000A-E12 AMD Instinct MI300X 192GB HBM3 GPU Server (8-GPU)

The ASUS ESC8000A-E12 is a high-density 4U rack server engineered to house eight AMD Instinct MI300X accelerators, each equipped with 192GB of HBM3 memory, delivering a combined 1.536TB of high-bandwidth memory within a single chassis. Built on AMD's CDNA 3 architecture, the MI300X APU integrates CPU compute dies alongside GPU compute dies in a unified memory architecture, enabling unprecedented memory capacity and bandwidth for memory-bound AI and HPC workloads. The ESC8000A-E12 platform supports dual AMD EPYC processors, PCIe 5.0 connectivity, and a purpose-built thermal and power delivery infrastructure designed to sustain peak performance across all eight accelerators simultaneously.

The server is purpose-built for large-scale generative AI inference and training, where the 192GB per-GPU memory footprint allows multi-billion and even trillion-parameter models to reside entirely within GPU memory without model sharding across multiple nodes. AMD Infinity Fabric interconnects link the MI300X accelerators at high bandwidth, reducing inter-GPU communication overhead during distributed training and enabling tightly coupled multi-GPU workloads. The ESC8000A-E12 chassis supports high-efficiency direct airflow cooling and redundant power supply configurations to meet the sustained power demands of eight MI300X accelerators operating at full load.

Designed for enterprise datacenters, cloud service providers, and AI research institutions, the ASUS ESC8000A-E12 with MI300X is ROCm-compatible and integrates with leading AI and HPC software stacks including PyTorch, TensorFlow, JAX, and OpenMPI. Omnixon Global supplies this platform to enterprise and institutional buyers across the UAE, GCC, EMEA, and APAC regions, supporting datacenter-scale deployments of generative AI, scientific simulation, and high-performance analytics infrastructure.

Ideal for

• Large language model (LLM) training and fine-tuning requiring massive per-GPU memory to host multi-hundred-billion parameter models without cross-node sharding
• Generative AI inference serving for production deployments where high HBM3 capacity enables simultaneous hosting of multiple large models or extended context windows
• High-performance computing simulations in fields such as climate modeling, computational fluid dynamics, and molecular dynamics that demand high memory bandwidth and GPU compute density
• Enterprise AI research and development environments requiring a high-memory-density GPU platform compatible with ROCm and open-source ML frameworks
• Multi-GPU distributed deep learning workflows leveraging AMD Infinity Fabric for low-latency inter-accelerator communication within a single 4U chassis
• Data analytics and recommendation system training at scale, where the unified memory architecture of the MI300X reduces data movement overhead across complex pipelines

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.