Brand: AMD EPYC | Category: CPUs
SKU: AMDE-338CBBJ | Part #: 338-CBBJ | MPN: 338-CBBJ
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The AMD EPYC 9654 represents the flagship single-socket configuration of the EPYC 9004 series, engineered on 5nm process technology with 128 cores and 256 threads operating at up to 2.4 GHz boost frequency. Designed for maximum performance per socket in 1U/2U server form factors, this processor excels in CPU-intensive enterprise applications requiring sustained multi-threaded throughput. The architecture features 12-channel DDR5 memory support, PCIe 5.0 I/O connectivity, and integrated security features including AMD SEV-SNP for encrypted virtual machine execution, making it the preferred choice for virtualization-dense, HPC-adjacent, and analytics-heavy deployments across Fortune 500 infrastructure modernization initiatives.
| Manufacturer | AMD EPYC |
| Model | EPYC 9654 |
| Form Factor | Tray (Socket SP5) |
| Cores/Threads | 128 cores / 256 threads |
| Base Frequency | 2.0 GHz |
| Boost Frequency | 2.4 GHz |
| L3 Cache | 384 MB |
| TDP | 360W |
| Process Node | 5nm FinFET |
| Memory Channels | 12x DDR5 |
| Max Memory Speed | 5600 MT/s |
| Max Memory Capacity | 768 GB (single socket) |
| PCIe Version | PCIe 5.0 |
| PCIe Lanes | 128 lanes |
| Instruction Sets | x86-64, AVX-512, AMD-V, SEV, SEV-SNP |
| Thermal Design Power (TDP) | 360W nominal |
| Socket Type | SP5 LGA1718 |
| Launch Date | Q1 2023 |
| Target Segment | Enterprise datacenter single-socket 1U/2U servers |
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| Brand | AMD EPYC |
| Category | CPUs |
| SKU | AMDE-338CBBJ |
| Part Number | 338-CBBJ |
| Condition | New |
| Model | EPYC 9654 |
| Form Factor | OEM Tray (Socket SP5) |
| Cores/Threads | 128 cores / 256 threads |
| Base Frequency | 2.0 GHz |
| Boost Frequency | 2.4 GHz |
| L3 Cache | 384 MB |
| TDP | 360W |
| Process Node | 5nm FinFET |
| Memory Channels | 12x DDR5 |
| Max Memory Speed | 5600 MT/s |
| Max Memory Capacity | 768 GB (single socket) |
| PCIe Version | PCIe 5.0 |
| PCIe Lanes | 128 lanes |
| Instruction Sets | x86-64, AVX-512, AMD-V, SEV, SEV-SNP |
| Thermal Design Power (TDP) | 360W nominal |
| Socket Type | SP5 LGA1718 |
| Launch Date | Q1 2023 |
| Target Segment | Enterprise datacenter single-socket 1U/2U servers |