Brand: SK Hynix | Category: Memory (RAM)
SKU: H5CG4AGBMD | Part #: H5CG4AGBMD | MPN: H5CG4AGBMD
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SK Hynix HBM3E 8-Hi 24GB Stack delivers extreme memory bandwidth over 1.1 TB/s in a compact 24 GB configuration, purpose-built for next-generation AI accelerators and high-performance computing infrastructure.
The SK Hynix H5CG4AGBMD is an HBM3E-standard memory stack engineered for demanding datacenter and AI workloads. This 8-Hi Stack configuration integrates 8 DRAM dies plus 1 base die, stacked via Through-Silicon Via (TSV) technology and packaged in 2.5D interposer integration compatible with advanced packaging standards. The 1024-bit memory bus width and 16 channels per stack, leveraging pseudo-channel architecture with 2 pseudo channels per channel, enable the quoted memory bandwidth performance of over 1.1 TB/s per stack. Operating at a nominal voltage of 1.05 V and featuring on-die ECC for data integrity, the HBM3E PHY interface connects seamlessly to leading-edge SoCs. SK Hynix has optimized this stack for AI accelerators, HPC GPUs, and datacenter compute processors where memory throughput is a critical bottleneck.
Data center infrastructure teams, AI platform architects, and enterprise IT procurement professionals evaluating next-generation GPU and accelerator deployments will recognize the HBM3E standard as essential for maximizing compute density and training throughput in large-scale AI and HPC environments. The 24 GB capacity per stack and bandwidth characteristics address the memory demands of transformer models, scientific simulations, and real-time inference pipelines where traditional GDDR or DDR solutions fall short. SK Hynix's proven manufacturing heritage in advanced memory stacks ensures reliability and consistency across high-volume deployments.
Omnixon Global specializes in enterprise-grade memory and accelerator components for the region's leading datacenters and system integrators. To inquire about availability, specifications, and volume pricing for the SK Hynix H5CG4AGBMD HBM3E stack, please submit a request for quotation through our technical sales team.
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | H5CG4AGBMD |
| Part Number | H5CG4AGBMD |
| Condition | New |
| Manufacturer Part Number | H5CG4AGBMD |
| Memory Standard | HBM3E |
| Configuration | 8-Hi Stack |
| Capacity per Stack | 24 GB |
| Die Count | 8 DRAM dies + 1 base die |
| Memory Bus Width | 1024-bit |
| Memory Bandwidth (per stack) | Over 1.1 TB/s |
| Interface | HBM3E PHY |
| Memory Type | DRAM (HBM3E) |
| Stack Interconnect | Through-Silicon Via (TSV) |
| Packaging | 2.5D interposer integration (CoWoS / equivalent advanced packaging compatible) |
| Channels per Stack | 16 |
| Pseudo Channel Architecture | Yes (2 pseudo channels per channel) |
| Operating Voltage (VDD) | 1.05 V (nominal) |
| Error Correction | On-die ECC |
| Application | AI accelerators, HPC GPUs, datacenter compute SoCs |
The SK Hynix HBM3E 8-Hi 24GB Stack is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. SK Hynix validates this module against major server vendor compatibility matrices.