Brand: SK Hynix | Category: Memory (RAM)
SKU: SKHY-H5CG8AGBDM010RBL | Part #: H5CG8AGBDM010RBL | MPN: H5CG8AGBDM010RBL
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The SK Hynix HBM3E 36GB Stack (Mach-1) from SK Hynix is enterprise-grade Memory (RAM) hardware built for data centers. SK Hynix HBM3E 36GB Mach-1 delivers 1.18 TB/s of bandwidth per stack, setting a new performance benchmark for AI accelerator and data center GPU integration. Available in brand new condition. SK Hynix memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | SKHY-H5CG8AGBDM010RBL |
| Part Number | H5CG8AGBDM010RBL |
| Condition | New |
| Product Name | HBM3E 36GB Stack (Mach-1) |
| Memory Standard | HBM3E (JEDEC JESD238) |
| Capacity per Stack | 36 GB |
| Die Configuration | 12-high active DRAM dies + 1 base logic die (12H stack) |
| Capacity per Die | 3 GB (24 Gb) |
| Interface Width | 1024-bit (per stack) |
| Memory Channels per Stack | 16 channels × 64-bit |
| Data Rate per Pin | Up to 9.2 Gbps |
| Peak Bandwidth per Stack | 1.18 TB/s |
| Memory Technology | 10nm-class (1c nm node) DRAM |
| Interconnect Technology | Through-Silicon Via (TSV) |
| Packaging Compatibility | 2.5D silicon interposer (CoWoS, EMIB, and equivalent advanced packaging platforms) |
| Error Correction | On-die ECC (ODECC) per die layer |
| Operating Voltage (VDD) | 1.05 V nominal |
| Typical Power Consumption | Approximately 15–20 W per stack at peak bandwidth (workload dependent) |
| Form Factor | HBM stack die module (bare die, interposer-mounted) |
| Stack Height (physical) | ≈ 720 µm (12H TSV stack) |
| Target Integration | AI GPU packages, AI ASIC packages (co-packaged via silicon interposer) |
| Launch Generation | HBM3E (4th-generation HBM) |
| Commercial Availability | Q1 2025 |
| Primary Market Segment | Data center AI training and inference accelerators, HPC |