SK Hynix HBM3E 36GB 8-Hi Stack (Palloc)
Brand: SK Hynix | Category: Memory (RAM)
SKU: SKHY-HBM3E36GB8HIPA | Part #: HBM3E-36GB-8HI-PA | MPN: HBM3E-36GB-8HI-PA
Contact for Pricing — Request a Quote
About the SK Hynix HBM3E 36GB 8-Hi Stack (Palloc)
The SK Hynix HBM3E 36GB 8-Hi Stack (Palloc) from SK Hynix is enterprise-grade Memory (RAM) hardware built for data centers. SK Hynix HBM3E 36GB 8-Hi delivers over 1.2 TB/s bandwidth per stack, enabling larger AI model residency and accelerating next-generation GPU and accelerator workloads. Available in brand new condition. SK Hynix memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
Technical Specifications
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | SKHY-HBM3E36GB8HIPA |
| Part Number | HBM3E-36GB-8HI-PA |
| Condition | New |
| Product Line | HBM3E |
| Model / Codename | Palloc |
| Generation | HBM3E (5th Generation HBM) |
| Stack Height | 8-Hi (8 core DRAM dies + 1 base logic die) |
| Capacity per Stack | 36 GB |
| Memory Interface Width | 1024-bit |
| Peak Bandwidth per Stack | >1.2 TB/s |
| Data Rate | ≥ 9.6 Gbps per pin (HBM3E specification) |
| Number of Pseudo Channels | 16 pseudo channels per stack |
| TSV (Through-Silicon Via) Count | High-density TSV interconnect (thousands of vias per die interface) |
| Die-to-Die Interface | Micro-bump array via silicon interposer / CoWoS integration |
| ECC Support | On-die ECC with advanced multi-bit error correction |
| Operating Voltage (VDD) | 1.1 V nominal |
| Thermal Management | On-die thermal sensors; compatible with direct liquid cooling and cold-plate thermal solutions |
| Package Form Factor | Bare-die stack for 2.5D interposer integration (CoWoS / EMIB compatible) |
| Stack Dimensions (Footprint) | ~11.87 mm × 11.0 mm (per HBM3E JEDEC standard footprint) |
| Operating Temperature Range | 0°C to 95°C junction (datacenter profile) |
| JEDEC Compliance | JEDEC HBM3E standard |
| Power Efficiency | Improved bit-per-joule efficiency relative to HBM3 through process node and architecture optimizations |
| Target Host Devices | AI training accelerators, datacenter GPUs, HPC ASICs requiring HBM3E memory subsystems |
| Launch Date | Q2 2025 |
Frequently Asked Questions about SK Hynix HBM3E 36GB 8-Hi Stack (Palloc)
What does the SK Hynix HBM3E 36GB 8-Hi Stack (Palloc) do?
The SK Hynix HBM3E 36GB 8-Hi Stack (Palloc) is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. SK Hynix validates this module against major server vendor compatibility matrices.
What are the headline specs of the SK Hynix HBM3E 36GB 8-Hi Stack (Palloc)?
Key specifications for the SK Hynix HBM3E 36GB 8-Hi Stack (Palloc): new condition; manufacturer SK Hynix; product line HBM3E; model / codename Palloc; generation HBM3E (5th Generation HBM); stack height 8-Hi (8 core DRAM dies + 1 base logic die); capacity per stack 36 GB. Manufacturer part number HBM3E-36GB-8HI-PA. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.