Brand: SK Hynix | Category: Memory (RAM)
SKU: SKH-H5CG9AGBMD-X0CM | Part #: H5CG9AGBMD-X0CM | MPN: H5CG9AGBMD-X0CM
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The SK Hynix HBM3E 12-Hi 48GB Enterprise AI Memory Stack from SK Hynix is enterprise-grade Memory (RAM) hardware built for data centers. It features 48GB capacity. The SK Hynix HBM3E 12-Hi 48GB Enterprise AI Memory Stack (H5CG9AGBMD-X0CM) represents the leading edge of High Bandwidth Memory technology, built on SK Hynix's third-generation HBM3E architecture. The 12-Hi stacking configuration places twelve DRAM dies vertically interconnected through through-silicon via (TSV) technology, achieving a 48GB capacity per stack. HBM3E advances over HBM3 with elevated per-pin data rates and refined signaling integrity, delivering aggregate memor Available in brand new condition. SK Hynix memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | SKH-H5CG9AGBMD-X0CM |
| Part Number | H5CG9AGBMD-X0CM |
| Condition | New |
| Capacity | 48GB |
| Manufacturer Part Number | H5CG9AGBMD-X0CM |
| Memory Technology | HBM3E (High Bandwidth Memory 3E) |
| Stack Height | 12-Hi (12 DRAM dies per stack) |
| Capacity Per Stack | 48 GB |
| Memory Bus Width | 1024-bit |
| Number of Channels Per Stack | 16 |
| Bits Per Channel | 64-bit |
| Aggregate Bandwidth Per Stack | Over 1.2 TB/s |
| Data Rate Per Pin | Up to 9.6 Gbps |
| Die Interconnect Technology | Through-Silicon Via (TSV) |
| Integration Method | 2.5D interposer (co-packaged with compute die) |
| Memory Standard Compliance | JEDEC HBM3E |
| Form Factor | Bare-die stack for interposer-based co-packaging |
| Operating Voltage | 1.1 V (VDD) |
| ECC Support | Yes — on-die ECC |
| Target Application | AI accelerators, HPC GPUs, datacenter compute SoCs |
| Process Node | SK Hynix advanced DRAM process (sub-20nm class) |
The SK Hynix HBM3E 12-Hi 48GB Enterprise AI Memory Stack is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. SK Hynix validates this module against major server vendor compatibility matrices.
Key specifications for the SK Hynix HBM3E 12-Hi 48GB Enterprise AI Memory Stack: capacity 48GB; 3 years support; new condition; performance 2 TB/s bandwidth; support 3 years standard (manufacturer). Manufacturer part number H5CG9AGBMD-X0CM. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.