Brand: Samsung | Category: Memory (RAM)
SKU: SAMS-K4EBE304EBEGCG | Part #: K4EBE304EB-EGCG | MPN: K4EBE304EB-EGCG
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The Samsung LPDDR5X 64GB Package from Samsung is enterprise-grade Memory (RAM) hardware built for data centers. Samsung's 64GB LPDDR5X package delivers up to 68 GB/s bandwidth in an ultra-compact form factor engineered for edge AI inference and next-generation compact server deployments. Available in brand new condition. Samsung memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | SAMS-K4EBE304EBEGCG |
| Part Number | K4EBE304EB-EGCG |
| Condition | New |
| Product Name | LPDDR5X 64GB Package |
| Memory Type | LPDDR5X |
| Total Capacity | 64 GB |
| Launch Date | 2025 Q1 |
| Data Rate | Up to 8533 Mbps per pin |
| Peak Memory Bandwidth | Up to 68 GB/s |
| Operating Voltage (VDD2) | 1.05V |
| I/O Voltage (VDDQ) | 0.5V |
| Package Type | Multi-die stacked LPDDR5X package |
| Bus Width | 64-bit (x64) per channel |
| Number of Channels | 4 (configurable per system design) |
| Error Correction | On-Die ECC (ODECC) |
| Prefetch Architecture | 16n prefetch |
| Refresh Mode | All-Bank Refresh, Per-Bank Refresh, Same-Bank Refresh (ARFM) |
| Operating Temperature Range | 0°C to 85°C (extended industrial variants available) |
| Package Form Factor | BGA (Ball Grid Array), compact multi-die integration |
| Process Node | Samsung advanced LPDDR5X process node |
| Power Management Features | Deep Sleep Mode, Hibernate Mode, dynamic frequency scaling |
| Target Platform | Edge servers, AI inference appliances, 5G MEC nodes, compact computing modules |
| Compliance & Standards | JEDEC LPDDR5X specification (JESD209-5B) |
| Special Features | Low-power architecture, high-density multi-die stacking, thermally optimized for passive cooling designs |