Samsung HBM3E 36GB 12-Hi Stack
Brand: Samsung | Category: Memory (RAM)
SKU: S-K4U8E3S4AA-MGCL | Part #: K4U8E3S4AA-MGCL | MPN: K4U8E3S4AA-MGCL
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About the Samsung HBM3E 36GB 12-Hi Stack
The Samsung HBM3E 36GB 12-Hi Stack from Samsung is enterprise-grade Memory (RAM) hardware built for data centers. It features 36GB capacity. The Samsung HBM3E 36GB 12-Hi Stack (part number K4U8E3S4AA-MGCL) represents Samsung's latest generation of High Bandwidth Memory, built on the HBM3E (HBM3 Extended) specification and constructed as a 12-layer die stack. This architecture delivers a substantial leap in memory capacity and bandwidth over prior HBM3 8-Hi configurations, making it one of the highest-capacity HBM solutions commercially available. The 12-Hi stacking process uses through-silicon via (TSV) technology Available in brand new condition. Samsung memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
Technical Specifications
| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | S-K4U8E3S4AA-MGCL |
| Part Number | K4U8E3S4AA-MGCL |
| Condition | New |
| Capacity | 36GB |
| Manufacturer Part Number | K4U8E3S4AA-MGCL |
| Memory Type | HBM3E (High Bandwidth Memory 3 Extended) |
| Capacity per Stack | 36 GB |
| Stack Configuration | 12-Hi (12-layer die stack) |
| Interface Width | 1024-bit per stack |
| Memory Bus Channels | 16 channels per stack (64-bit per channel) |
| Data Rate | HBM3E — up to 9.6 Gbps per pin |
| Peak Bandwidth per Stack | Up to 1.23 TB/s |
| Supply Voltage (VDDQ) | 1.1 V |
| Die Interconnect Technology | Through-Silicon Via (TSV) |
| Packaging Interface | Micro-bump, designed for 2.5D silicon interposer integration |
| ECC Support | Yes — on-die ECC |
| Operating Temperature | 0°C to 70°C (junction) |
| Form Factor | HBM stack (bare die / interposer-mount) |
| Generation | HBM3E |
| Standard Compliance | JEDEC HBM3E specification |
Frequently Asked Questions about Samsung HBM3E 36GB 12-Hi Stack
What does the Samsung HBM3E 36GB 12-Hi Stack do?
The Samsung HBM3E 36GB 12-Hi Stack is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Samsung validates this module against major server vendor compatibility matrices.
What are the headline specs of the Samsung HBM3E 36GB 12-Hi Stack?
Key specifications for the Samsung HBM3E 36GB 12-Hi Stack: capacity 36GB; 3 years support; new condition; performance 2 TB/s bandwidth per stack for next-gen GPU and AI accelerator integration in enterprise AI infrastructure; support 3 years standard (manufacturer). Manufacturer part number K4U8E3S4AA-MGCL. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.