Samsung HBM3E 36GB Cube
Brand: Samsung | Category: Memory (RAM)
SKU: SAMS-K4UAABFBMDNW05 | Part #: K4UAABFBMD-NW05 | MPN: K4UAABFBMD-NW05
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About the Samsung HBM3E 36GB Cube
The Samsung HBM3E 36GB Cube from Samsung is enterprise-grade Memory (RAM) hardware built for data centers. Samsung's 36GB HBM3E Cube delivers over 1.2 TB/s of memory bandwidth to power next-generation AI accelerators and GPU-based training clusters. Available in brand new condition. Samsung memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
Technical Specifications
| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | SAMS-K4UAABFBMDNW05 |
| Part Number | K4UAABFBMD-NW05 |
| Condition | New |
| Product Name | HBM3E 36GB Cube |
| Generation | HBM3E (4th Generation HBM) |
| Capacity per Stack | 36 GB |
| Die Configuration | 12-layer stacked DRAM dies + 1 base logic die |
| Process Node | Samsung 1c-nm DRAM |
| Interface Width | 1,024-bit per cube |
| Data Rate | Up to 9.8 Gbps per pin |
| Peak Bandwidth per Cube | >1.2 TB/s |
| Operating Voltage (VDD) | 1.05 V nominal |
| Error Correction | On-die ECC covering DRAM arrays and TSV interconnect fabric |
| Through-Silicon Via (TSV) Count | >50,000 TSVs per stack |
| Package Type | HBM3E Cube (interposer-mount, JEDEC compliant) |
| Compliance Standard | JEDEC HBM3E |
| Form Factor | Cube package for 2.5D/3D silicon interposer integration |
| Temperature Range (Operating) | 0°C to 95°C junction (accelerator profile) |
| Thermal Interface | Top-die heat spreader compatible with direct liquid cooling assemblies |
| Power Consumption (Typical) | Approx. 20–25 W per cube at full bandwidth utilization |
| Coplanarity Tolerance | ≤50 µm (enhanced for high-density multi-cube substrates) |
| Target Integration | GPU accelerators, custom AI ASICs, FPGA inference platforms via silicon interposer |
| Launch Quarter | Q1 2025 |
| Supported Memory Modes | Pseudo-channel mode, AiM-ready architecture |
Frequently Asked Questions about Samsung HBM3E 36GB Cube
What does the Samsung HBM3E 36GB Cube do?
The Samsung HBM3E 36GB Cube is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Samsung validates this module against major server vendor compatibility matrices.
What are the headline specs of the Samsung HBM3E 36GB Cube?
Key specifications for the Samsung HBM3E 36GB Cube: new condition; manufacturer Samsung; product name HBM3E 36GB Cube; generation HBM3E (4th Generation HBM); capacity per stack 36 GB; die configuration 12-layer stacked DRAM dies + 1 base logic die; process node Samsung 1c-nm DRAM. Manufacturer part number K4UAABFBMD-NW05. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.