Samsung HBM3E 36GB Aquabolt-XM

Brand: Samsung | Category: Memory (RAM)

SKU: K3LK7K700B-XGCP | Part #: K3LK7K700B-XGCP | MPN: K3LK7K700B-XGCP

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The Samsung HBM3E 36GB Aquabolt-XM (part number K3LK7K700B-XGCP) is a Known-Good Die (KGD) memory module engineered for 2.5D and 3D interposer integration in next-generation AI accelerators, HPC GPUs, and AI ASICs. This Samsung memory device delivers 36 GB capacity per stack with a 12-layer DRAM die stack (12-Hi configuration) and operates at 1.2 V supply voltage. The module features a 1024-bit interface width per stack, distributed across 16 channels of 64-bit width each, enabling the ultra-high bandwidth throughput required by today's most demanding computational workloads. Built to JEDEC HBM3E standard compliance, the Aquabolt-XM incorporates Through-Silicon Via (TSV) interconnect technology for direct die-to-interposer mounting and includes on-die ECC (ODECC) per JEDEC HBM3E specification to ensure data integrity in mission-critical environments.

AI infrastructure teams, GPU manufacturers, and ASIC designers responsible for deploying cutting-edge machine learning and high-performance computing platforms specify Samsung HBM3E memory for its proven reliability and performance characteristics. Organizations building advanced GPU clusters, training infrastructure, and custom silicon solutions require the exceptional bandwidth and density that HBM3E technology provides, and the Aquabolt-XM's 36 GB per-stack capacity reduces overall system complexity while maximizing computational density. The bare die form factor and KGD qualification ensure seamless integration into 2.5D and 3D packaging architectures where precision and yield matter most.

Omnixon Global supplies the Samsung HBM3E 36GB Aquabolt-XM (K3LK7K700B-XGCP) to enterprise customers across the UAE and beyond. For pricing, availability, lead times, and technical configuration support, submit your request for quotation through Omnixon Global's B2B procurement portal today.