Brand: Samsung | Category: Memory (RAM)
SKU: K3LK9K90EM-NGCP | Part #: K3LK9K90EM-NGCP | MPN: K3LK9K90EM-NGCP
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Operating at a nominal supply voltage of 1.1 V and engineered for the stringent latency requirements of in-memory databases and high-frequency compute workloads, the Samsung HBM3E 36GB Aquabolt-XL Stack (part number K3LK9K90EM-NGCP) represents the latest generation of high-bandwidth memory technology for enterprise datacenters. This Samsung memory module delivers a total capacity of 36 GB per stack with an exceptionally wide 1024-bit bus architecture distributed across 16 channels, each operating at 64-bit width. The stack itself comprises a 12-Hi configuration—12 DRAM dies plus 1 base logic die—interconnected via Through-Silicon Via (TSV) technology and integrated into a 2.5D interposer package using advanced CoWoS or equivalent methods. With memory bandwidth exceeding 1.2 TB/s and HBM3E-generation data rates reaching up to approximately 9.6 Gbps per pin, this stack conforms fully to the JEDEC HBM3E interface standard and includes on-die ECC as an intrinsic feature for error correction in mission-critical environments.
AI infrastructure teams, HPC procurement specialists, and datacenter GPU architects are the primary buyers for this class of component, driven by the explosive demand for accelerator memory in large-scale model training, inference serving, and scientific computing clusters. The Samsung HBM3E 36GB Aquabolt-XL Stack is purpose-built for integration into AI accelerators and HPC processors where memory-bandwidth bottlenecks directly impact throughput and total cost of ownership. Its operating temperature range of 0°C to 85°C junction aligns with standard datacenter thermal envelopes, ensuring reliability across hyperscale deployment scenarios where thermal management is non-negotiable.
For enterprise customers evaluating next-generation accelerator platforms or upgrading existing high-performance computing infrastructure, Omnixon Global provides direct access to Samsung memory solutions with full technical specification validation and logistics support across the UAE and wider Middle East region. To request a quote for the K3LK9K90EM-NGCP or explore volume pricing and delivery options, please submit an RFQ through Omnixon Global's technical sales team.
```| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | K3LK9K90EM-NGCP |
| Part Number | K3LK9K90EM-NGCP |
| Condition | New |
| Manufacturer Part Number | K3LK9K90EM-NGCP |
| Product Line | Aquabolt-XL |
| Memory Type | HBM3E (High Bandwidth Memory 3E) |
| Total Capacity per Stack | 36 GB |
| Stack Height | 12-Hi (12 DRAM dies + 1 base logic die) |
| Bus Width per Stack | 1024-bit |
| Number of Channels per Stack | 16 |
| Bus Width per Channel | 64-bit |
| Memory Bandwidth per Stack | >1.2 TB/s |
| Data Rate | HBM3E generation (up to ~9.6 Gbps per pin) |
| Supply Voltage (VDD2H) | 1.1 V (nominal) |
| Error Correction | On-die ECC (intrinsic to HBM3E standard) |
| Interface Standard | JEDEC HBM3E |
| Package / Integration Method | 2.5D interposer (CoWoS or equivalent advanced packaging) |
| Interconnect Technology | Through-Silicon Via (TSV) |
| Form Factor | Bare-die stack for SiP / accelerator module integration |
| Operating Temperature Range | 0°C to 85°C junction (typical datacenter operating envelope) |
| Primary Application Segment | AI accelerators, HPC processors, datacenter GPU |
The Samsung HBM3E 36GB Aquabolt-XL Stack is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Samsung validates this module against major server vendor compatibility matrices.