Samsung 32GB DDR5 RDIMM M321R4GA3EB2-CWM

Brand: Samsung | Category: Memory (RAM)

SKU: SAM-M321R4GA3EB2CWM | Part #: M321R4GA3EB2-CWM | MPN: M321R4GA3EB2-CWM

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A single Samsung 32GB DDR5 RDIMM M321R4GA3EB2-CWM module represents the foundational building block of modern enterprise server memory architecture. In a 2-socket Intel Xeon Scalable or AMD EPYC platform, you can populate up to 12 DIMM slots per socket, enabling configurations of 768GB total system memory from the M321R4GA3EB2-CWM alone. For organizations running memory-intensive workloads—high-frequency trading engines, large language model inference, distributed database clusters, or real-time analytics platforms—this capacity ceiling matters enormously. The decision to standardize on 32GB modules across your fleet has direct implications for server utilization efficiency and total cost of ownership.

Samsung's engineering on the M321R4GA3EB2-CWM reflects the maturity of DDR5 production at scale. Operating at 5600 Mbps with a CAS latency of 46 cycles, this module delivers the bandwidth profile that enterprise infrastructure teams have come to expect from memory rated to this speed class. The dual-rank, x8 organization (2Rx8) strikes a practical balance between density and electrical loading on the memory controller—something your data-centre architect will recognize immediately. Registered DIMM architecture with both standard and on-die ECC ensures that the memory subsystem can detect and correct single-bit errors in flight, a non-negotiable requirement for any infrastructure handling financial data, medical records, or mission-critical compute. The 1.1V operating voltage is the DDR5 standard, and Samsung's 288-pin implementation is the universal form factor across Intel and AMD DDR5 platforms launched from 2023 onwards.

Compatibility with 4th Generation Intel Xeon Scalable (Sapphire Rapids) and AMD EPYC Genoa processors means the M321R4GA3EB2-CWM sits at the leading edge of mainstream enterprise adoption. These platforms are no longer emerging—they are the default choice for new data-centre builds across the GCC and Asia-Pacific regions in 2024 and beyond. Storage architects and virtualization teams evaluating refresh cycles for 3-year-old infrastructure will find Samsung modules like this one drop directly into approved Bill of Materials for both platforms. Thermal headroom spans 0°C to 85°C operating range, accommodating everything from liquid-cooled GPU-dense systems to traditional air-cooled 2U rackmount servers with modest airflow management. The timing specification of 46-45-45-90 (CL-tRCD-tRP-tRAS) reflects Samsung's conservative tuning strategy—these are bins optimized for stability across manufacturing variance, not for pushing the absolute limits of speed at the expense of reliability.

Procurement teams and systems administrators who manage capital spend on memory upgrades will appreciate that the M321R4GA3EB2-CWM comes from a vendor with established supply-chain depth. Samsung's memory division maintains consistent quality metrics across their DDR5 production, and this part number has accrued sufficient field-deployed hours in major hyperscaler environments to have proven its durability. When you're evaluating SKUs for a 50-server deployment of Kubernetes worker nodes or a refresh of your SAP HANA landscape, standardization on a single Samsung module simplifies spare inventory management and reduces the likelihood of performance surprises from mixing speed grades or rank configurations. Network engineers and AI infrastructure teams planning large-scale fine-tuning clusters benefit from the certainty that memory bandwidth will not become the bottleneck—5600 Mbps per channel across a full 12-DIMM population provides the throughput needed for sustained GPU utilization on multi-node training jobs.

Omnixon Global maintains direct distribution relationships with Samsung for enterprise-class memory products across the UAE, Saudi Arabia, and broader Asia-Pacific markets. We stock the M321R4GA3EB2-CWM for immediate allocation to qualifying enterprise customers, with regional logistics optimized for data-centre deployment schedules. Whether you are specifying memory for a new facility build, executing a major hardware refresh, or building a validated parts list for a large-scale RFQ, our technical team can coordinate Samsung product allocation, arrange compatibility verification with your specific Xeon or EPYC configuration, and manage the documentation and certification required for compliance-heavy sectors. Contact us for availability, volume pricing, and technical support aligned to your procurement timeline.

Memory Performance and Platform Specifications

• DDR5-5600 data transfer rate with 46-cycle CAS latency ensures predictable memory subsystem performance across enterprise workloads without thermal throttling or stability concerns
• Dual-rank (2Rx8) organization balances 32GB capacity density with acceptable memory controller electrical loading on both Intel Xeon Scalable and AMD EPYC platforms
• Registered DIMM architecture with on-die ECC enables error detection and correction at the module level, eliminating single-bit errors before they propagate to system memory or affect application state
• Compatible with 4th Generation Intel Xeon Scalable (Sapphire Rapids) and AMD EPYC Genoa processor families, the dominant refresh cycle across enterprise data centres and AI infrastructure deployments in 2024
• 1.1V operating voltage and 0°C to 85°C thermal operating range accommodate both traditional air-cooled server designs and next-generation liquid-cooled configurations for GPU-accelerated compute
• 288-pin form factor standardized across all DDR5 RDIMM implementations, enabling straightforward module swaps and upgrades without platform re-qualification