Micron HBM3E 12-Hi 36GB
Brand: Micron | Category: Memory (RAM)
SKU: M-MT60B4G16JG-H00 | Part #: MT60B4G16JG-H00 | MPN: MT60B4G16JG-H00
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About the Micron HBM3E 12-Hi 36GB
The Micron HBM3E 12-Hi 36GB from Micron is enterprise-grade Memory (RAM) hardware built for data centers. It features 36GB capacity. The Micron HBM3E 12-Hi 36GB (MT60B4G16JG-H00) represents Micron's third-generation High Bandwidth Memory implementation, built on the HBM3E specification and stacked to 12 active die layers. Each stack delivers a 1024-bit wide memory interface and operates at up to 9.2 Gbps per pin, yielding a peak memory bandwidth of approximately 1.2 TB/s per stack. The architecture employs through-silicon via (TSV) interconnects and micro-bump bonding to achieve exceptional data throughput Available in brand new condition. Micron memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
Technical Specifications
| Brand | Micron |
| Category | Memory (RAM) |
| SKU | M-MT60B4G16JG-H00 |
| Part Number | MT60B4G16JG-H00 |
| Condition | New |
| Capacity | 36GB |
| Manufacturer Part Number | MT60B4G16JG-H00 |
| Memory Type | HBM3E (High Bandwidth Memory 3E) |
| Capacity per Stack | 36 GB |
| Stack Configuration | 12-Hi (12 active DRAM die layers) |
| Memory Interface Width | 1024-bit |
| Data Rate | Up to 9.2 Gbps per pin |
| Peak Bandwidth per Stack | ~1.2 TB/s |
| Number of Channels per Stack | 16 |
| Channel Width | 64-bit per channel |
| Die-to-Die Interconnect | Through-Silicon Via (TSV) with micro-bump bonding |
| Package Interface | 2.5D silicon interposer (SoIC / CoWoS compatible) |
| JEDEC Compliance | JEDEC HBM3E standard |
| ECC Support | On-die ECC |
| Form Factor | Bare-die stack for OEM/accelerator integration |
| Target Platform | GPU, AI ASIC, and custom silicon accelerators |
Frequently Asked Questions about Micron HBM3E 12-Hi 36GB
What does the Micron HBM3E 12-Hi 36GB do?
The Micron HBM3E 12-Hi 36GB is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Micron validates this module against major server vendor compatibility matrices.
What is the Micron HBM3E 12-Hi 36GB?
The Micron HBM3E 12-Hi 36GB is a brand new memory (ram) product manufactured by Micron. It has the SKU M-MT60B4G16JG-H00 and part number MT60B4G16JG-H00. This enterprise-grade product is available from Omnixon Global.
What are the headline specs of the Micron HBM3E 12-Hi 36GB?
Key specifications for the Micron HBM3E 12-Hi 36GB: capacity 36GB; 3 years support; new condition; support 3 years standard (manufacturer). Manufacturer part number MT60B4G16JG-H00. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.
What are the key specifications of the Micron HBM3E 12-Hi 36GB?
The key specifications of the Micron HBM3E 12-Hi 36GB include: support: 3 years standard (manufacturer). Storage capacity: 36GB. For complete specifications and technical documentation, please contact our sales team.
Where can I buy the Micron HBM3E 12-Hi 36GB?
You can buy the Micron HBM3E 12-Hi 36GB from Omnixon Global, a trusted enterprise IT hardware supplier. We serve enterprises in over 100 countries. Request a quote through our website or contact our sales team directly.