Brand: Micron | Category: Memory (RAM)
SKU: MICR-MT62F3G32D8DV026 | Part #: MT62F3G32D8DV-026 | MPN: MT62F3G32D8DV-026
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The Micron HBM3E 36GB 8-High Stack from Micron is enterprise-grade Memory (RAM) hardware built for data centers. The Micron HBM3E 36GB 8-High Stack (MT62F3G32D8DV-026) represents Micron's third-generation High Bandwidth Memory implementation, built on the HBM3E JEDEC standard and manufactured using Micron's advanced 1β (1-beta) DRAM process node. The 8-Hi stacked architecture integrates nine dies — one base logic die plus eight DRAM dies — interconnected through thousands of through-silicon vias (TSVs), delivering extreme memory bandwidth and capacity in a compact 2.5D integration footp Available in brand new condition. Micron memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | Micron |
| Category | Memory (RAM) |
| SKU | MICR-MT62F3G32D8DV026 |
| Part Number | MT62F3G32D8DV-026 |
| Condition | New |
| Manufacturer Part Number | MT62F3G32D8DV-026 |
| Memory Standard | HBM3E (JEDEC JESD238) |
| Capacity per Stack | 36 GB |
| Stack Height | 8-Hi (8 DRAM dies + 1 base logic die) |
| Interface Width | 1024-bit per stack |
| Data Rate (per pin) | 9.6 Gbps |
| Peak Memory Bandwidth (per stack) | 1.2 TB/s |
| DRAM Process Node | Micron 1β (1-beta) |
| Interconnect Technology | Through-Silicon Via (TSV) with microbump bonding |
| Packaging / Integration Method | 2.5D interposer (HBM stack placed on silicon interposer alongside GPU die) |
| ECC Support | On-die ECC (ODECC) per JEDEC HBM3E specification |
| Primary Application | NVIDIA H200 Tensor Core GPU |
| Form Factor | HBM stack (non-user-replaceable; substrate-integrated) |