Micron 32GB DDR4-3200 ECC RDIMM Server Memory MTA36ASF4G72PZ-3G2R1

Brand: Micron | Category: Memory (RAM)

SKU: MTA36ASF4G72PZ-3G2R1 | Part #: MTA36ASF4G72PZ-3G2R1

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Product Overview

The Micron 32GB DDR4-3200 ECC RDIMM is a premium-grade, enterprise server memory module engineered to meet the demanding requirements of modern data centres, cloud infrastructure, and high-performance computing deployments. Built on Micron's world-class DRAM fabrication technology, this Registered DIMM (RDIMM) delivers a compelling combination of high bandwidth, low latency, and robust error correction that mission-critical servers demand around the clock.

Operating at DDR4-3200 (PC4-25600) speeds, this module pushes theoretical peak bandwidth to approximately 25,600 MB/s per channel, enabling processors to feed data to compute cores at the pace modern workloads require. The integrated Error-Correcting Code (ECC) engine continuously monitors memory transactions, detecting and correcting single-bit errors in real time and reporting multi-bit errors before they can corrupt data or destabilise the operating system — a non-negotiable requirement in enterprise IT environments where unplanned downtime translates directly into financial and reputational loss.

Micron is one of only three companies in the world that vertically integrates DRAM wafer fabrication, module assembly, and firmware development under a single roof. Every cell, every trace, and every register on this RDIMM is engineered and quality-verified by Micron engineers, giving IT procurement teams a clear chain of component accountability that third-party module vendors simply cannot match.

Key Features & Benefits

• DDR4-3200 Speed Grade: Operates at 3200 MT/s, delivering up to 25,600 MB/s peak theoretical bandwidth per channel — the fastest standard DDR4 speed bin, maximising throughput for memory-bandwidth-sensitive workloads such as in-memory databases and AI inference.
• 32GB Capacity per DIMM: A practical sweet spot for modern server configurations; a dual-socket server with 16 DIMM slots can be populated to 512 GB total system memory, supporting large VM footprints and expansive in-memory datasets without excessive module count.
• ECC (Error-Correcting Code): Automatically detects and corrects single-bit memory errors in real time using SECDED (Single Error Correct, Double Error Detect) logic, dramatically reducing the risk of data corruption and system crashes in 24/7 production environments.
• Registered (Buffered) Architecture: The on-module register buffers address and command signals from the memory controller, reducing electrical load on the CPU memory bus. This allows higher DIMM counts per channel compared to unbuffered memory, enabling maximum per-socket memory capacity scaling.
• x4 DRAM Organisation: The 4-bit-wide DRAM component organisation used in this module provides additional chip-level fault tolerance and is recommended by major OEMs for critical storage controllers and virtualisation hosts.
• Low Operating Voltage (1.2V): DDR4 operates at 1.2V nominal, reducing power consumption by approximately 20% compared to DDR3 at equivalent data rates, contributing to lower PUE scores and total cost of ownership in dense rack deployments.
• Thermal Sensor (SPD Thermal Sensor): An on-module temperature sensor communicates with the platform's baseboard management controller (BMC), enabling intelligent fan speed management and thermal throttling to protect memory integrity under heavy load.
• JEDEC-Compliant SPD: Serial Presence Detect data stored on the module's EEPROM ensures plug-and-play compatibility with JEDEC-compliant motherboards and eliminates the need for manual BIOS tuning in most enterprise server platforms.

Technical Architecture

The MTA36ASF4G72PZ-3G2R1 is a 288-pin, dual-rank, x4 RDIMM based on Micron's monolithic DDR4 SDRAM die technology. The module employs a 2Rx4 organisation, meaning it contains two independent ranks of memory, each composed of x4-wide DRAM components. This configuration provides increased capacity and sustained bandwidth through rank interleaving while maintaining signal integrity at 3200 MT/s across the memory bus.

At the heart of the module sits a Register Clock Driver (RCD), which buffers the command, address, and clock signals that travel from the host memory controller to each DRAM component. This register stage adds a single clock cycle of latency compared to unbuffered DIMMs but allows the memory bus to support up to two RDIMMs per channel without degrading signal integrity — a critical capability for high-memory-capacity server builds.

ECC functionality is implemented using nine DRAM devices per rank (eight data devices plus one dedicated ECC device), enabling SECDED correction across a 64-bit data bus with an 8-bit check-code overlay. The module's SPD EEPROM stores factory-programmed timing parameters, voltage settings, and thermal thresholds, which the host platform reads during POST to automatically configure the memory subsystem for safe and optimal operation.

Micron manufactures the DRAM dies used in this module at its own fabs using advanced DRAM process nodes, ensuring tight control over cell geometry, refresh timing, and data retention characteristics. All modules undergo rigorous burn-in and testing at Micron's facilities before shipment, meeting the reliability and quality standards required by leading server OEMs.

Performance & Capacity

At DDR4-3200, the MTA36ASF4G72PZ-3G2R1 delivers a theoretical peak bandwidth of 25,600 MB/s per memory channel. In a dual-channel configuration, which is common in single-socket workstation-class servers, aggregate bandwidth reaches approximately 51,200 MB/s. On a high-end dual-socket server platform with six memory channels per socket (twelve channels total), fully populating with these modules can deliver over 300 GB/s of aggregate memory bandwidth — sufficient to keep even the most data-hungry AI and HPC workloads fed.

Typical CAS latency (CL) timings for DDR4-3200 modules of this grade are CL22-22-22, translating to an absolute memory latency of approximately 13.75 nanoseconds — competitive with higher-speed DDR4 bins when accounting for real server platform controller overhead. For latency-sensitive workloads such as OLTP databases and real-time analytics, this performance profile ensures consistent sub-14ns memory access across the operating temperature range.

The 32GB per-module capacity enables flexible memory tiering strategies. A 1U server with 8 DIMM slots can be configured with 256 GB of total RAM using this module, while a 2U platform with 24 DIMM slots scales to 768 GB — ample for running dozens of virtualised workloads or a multi-terabyte in-memory SQL Server or SAP HANA instance when multiple modules are combined.

Compatibility & Integration

The MTA36ASF4G72PZ-3G2R1 is designed for compatibility with a broad range of enterprise server platforms that support DDR4 RDIMM memory. Compatible processor families include Intel Xeon Scalable (Ice Lake, Cascade Lake, Cooper Lake) and AMD EPYC (Naples, Rome, Milan, Genoa DDR4 modes) processors. It is qualified and listed on the memory compatibility lists of major server OEM platforms from HPE (ProLiant Gen10/Gen10 Plus), Dell EMC (PowerEdge R series), Lenovo (ThinkSystem), Supermicro, and Fujitsu PRIMERGY product lines.

The module is fully compliant with JEDEC DDR4 SDRAM standards (JESD79-4) and JEDEC RDIMM standards (JESD21C Annex L), ensuring interoperability across platforms without requiring custom firmware or BIOS patches. It supports industry-standard SPD (Serial Presence Detect) as defined in JEDEC SPD Annex L, enabling automatic memory detection and configuration on all compliant server motherboards.

• JEDEC DDR4 SDRAM Standard (JESD79-4) compliant
• Compatible with Intel Xeon Scalable 1st–4th Gen (DDR4 platforms)
• Compatible with AMD EPYC 1st–4th Gen (DDR4 platforms)
• Supports VMware vSphere, Microsoft Hyper-V, Red Hat Enterprise Linux, Windows Server
• RoHS compliant — meets EU and GCC environmental import regulations
• Listed on HPE, Dell EMC, Lenovo, Supermicro, and Fujitsu memory compatibility guides

Ideal Use Cases

• Enterprise Virtualisation (VMware / Hyper-V): High DIMM density and ECC reliability make this module ideal for hypervisor hosts running large numbers of VMs. The 32GB capacity per slot allows maximum VM density per server, reducing overall infrastructure footprint and licensing costs.
• In-Memory Databases (SAP HANA, Oracle TimesTen, Redis): Applications that load entire datasets into RAM benefit directly from the high bandwidth and large capacity of DDR4-3200 RDIMMs, enabling sub-millisecond query response times and eliminating storage I/O as a bottleneck.
• AI Inference and Machine Learning Preprocessing: While GPU HBM handles matrix operations, host system DRAM is responsible for data staging, model loading, and batch preparation. High-bandwidth DDR4-3200 memory reduces CPU-to-GPU data transfer latency, improving overall AI pipeline throughput.
• High-Performance Computing (HPC) Clusters: Scientific simulation, computational fluid dynamics, financial modelling, and genomics workloads are memory-bandwidth-constrained. DDR4-3200 RDIMMs deliver the maximum available bandwidth on current-generation DDR4 platforms, directly accelerating compute node performance.
• Cloud and Colocation Server Deployments: Bare-metal cloud servers and colocation racks demand the highest reliability memory to guarantee SLA uptime commitments. ECC RDIMM technology minimises memory-related system crashes, reducing unplanned downtime and support escalations.
• OLAP and Business Intelligence Platforms: Data warehouse engines such as Microsoft SQL Server Analysis Services and columnar stores benefit from large memory footprints and fast sequential read bandwidth, both of which this module delivers at DDR4-3200 speeds.
• Storage Controller and NAS Head Nodes: Enterprise NAS and SAN controllers use server-grade memory for metadata caching and write buffering. ECC protection is essential in these deployments to prevent cache corruption that could result in data loss or file system inconsistency.

Why Buy from Omnixon

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, with established supply chain relationships serving enterprise clients across the GCC region and beyond. When you source the Micron 32GB DDR4-3200 ECC RDIMM through Omnixon, you benefit from local stock availability in the UAE, streamlined customs-cleared import processes, and a team of enterprise hardware specialists who understand the procurement, compliance, and logistics requirements of data centre builds across Saudi Arabia, the UAE, Qatar, Kuwait, Bahrain, Oman, and international markets. Omnixon maintains rigorous product authenticity standards, sourcing only genuine, factory-sealed hardware from authorised channels — eliminating the risk of counterfeit or grey-market memory modules that can compromise server warranties and system stability. Our enterprise support team can assist with compatibility verification, bulk order configuration, and integration into existing server refresh projects, ensuring your procurement process is efficient and technically sound from first inquiry through to rack deployment.

Related Products & Ecosystem

To maximise the performance and reliability of your server memory upgrade, consider pairing this Micron RDIMM with complementary enterprise infrastructure components available from Omnixon's extensive catalogue. Compatible server platforms from Dell EMC, HPE, Lenovo, and Supermicro are available alongside the memory to support complete server configurations. For storage performance to match your memory bandwidth upgrade, explore Omnixon's range of Enterprise NVMe SSDs and Enterprise SAS/SATA SSDs that eliminate storage I/O as a bottleneck in memory-rich server environments. Network connectivity upgrades such as 25GbE and 100GbE Network Adapters & NICs ensure your servers can fully utilise their processing and memory headroom across the data centre fabric. For power protection and rack infrastructure supporting your server build, Omnixon also carries enterprise-grade UPS & Power Protection systems, Rack PDUs, and Server Rack & Enclosure solutions from leading brands — providing a single-source procurement experience for complete data centre infrastructure projects.